Komponente

Motherboard form factor Thin-Mini-ITX CPU socket 1700 Motherboard Chipset Intel H610 Memory slots 2x Memory type DDR5 max. Memory 64 GB Fan connectors (4-Pin PWM) 2x SATA 6G internal 2x M.2 (PCIe 4.0 x4) 1x M.2 (PCIe 4.0 x4 / SATA 6G) 1x US

Safety warning Warnings: Beware of sharp edges during assembly. Warnings: Keep the product away from water sources to prevent electrical damage. Warnings: Ensure that the enclosure is properly ventilated to avoid overheating of components.

Box Weight Brutto (kg): 0.12 kg , CAS Latency: CL22 , Compliant Devices: Notebook Other , Maximum Operating Ambient Temperature: 85 °C , Memory Features: Unbuffered Dual Rank , Memory Form Factor: SODIMM 260-pin , Memory Module Configuration: 1024

The FSP M581 combines an eye-catching panoramic design with powerful cooling and plenty of space for modern PC hardware. The curved tempered glass pane on the front and side allows an impressive 270° view of the installed components and impressively

The GIGABYTE B550 X GAMING is based on the AMD B550 chipset and supports AMD processors for Socket AM4. It has four DDR4 slots for up to 128 GB of memory. The GIGABYTE B550 The GIGABYTE B550Type: motherboardEAN: 4719331884079Manufacturer number: B550

Lastnosti- Kapaciteta: 16 GB- Tehnologija: DDR4- Hitrost: PC4-25600 3200 MT/s- Zakasnitev: CL22- Oblika: SODIMM- Napetost: 1,2V , SODIMM DDR4 pomnilnik s kapaciteto 16 GB deluje pri hitrosti 3200 MT/s in ima CL22 zakasnitev. Pomnilniki Crucial s

Design Number of fans: 1 fan(s) Fan diameter: 13.5 cm Cooling type: Active Product colour: Black Performance Mean time between failures (MTBF): 100000 h 80 PLUS certification: 80 PLUS Gold Power supply unit (PSU) form factor: ATX Purpose: PC ATX vers

The Fractal Epoch XL brings the clean, modern design of the Epoch series to a new format with generous interior space. With a mesh front and three powerful Momentum 14 fans, the case ensures that components can be reliably cooled. For ambitious build

Ultra vzdržljiv100 % japonski kondenzatorji120 mm pametni ventilator s hidravličnim ležajem (HYB)Optimizirana toplotna rešitevZaščita OVP / OPP / SCP / UVP / OCP / OTPPripravljen za Intel ATX 3.1 in PCIe Gen 5.1Certifikat 80 PLUS GoldPopolnoma modula